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  power management & multimarket data sheet revision 1.1, 2015-10-02 final ESD231-B1-W0201 bi-directional, 5.5 v, 3.5 pf, 0201, rohs and halogen free compliant ESD231-B1-W0201 protection device tvs (transient voltage suppressor)
edition 2015-10-02 published by infineon technologies ag 81726 munich, germany ? 2015 infineon technologies ag all rights reserved. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ) warnings due to technical requirements, components may contain dangerous substances. for in formation on the types in question, please contact the neares t infineon technologies office. infineon technologies components may be used in life-suppo rt devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or sys tem. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if t hey fail, it is reasonable to assume that the health of the user or other persons may be endangered.
ESD231-B1-W0201 product overview finaldata sheet 3 revision 1.1, 2015-10-02 1 product overview 1.1 features guidelines for optimized pcb design and assembly process available [2] 1.2 application examples ? usb 2.0 ha, mipi, ()sd-card (uhs), sim-card ? control ports for dvi, hdmi, display port, and thunderbolt ? audio line, speaker, headset, microphone protection ? human interface devices (keyboard, touchpad, buttons) 1.3 product description figure 1-1 pin configurati on and schematic diagram ? esd / transient protection of susceptible i/o lines to: ? iec61000-4-2 (esd): 30 kv (air/contact discharge) ? iec61000-4-4 (eft): 4 kv / 80 a(5/50 ns) ? iec61000-4-5 (surge): 12 a (8/20 s) ? bi-directional working voltage up to: v rwm =5.5v ? line capacitance: c l = 3.5 pf (typical) at f =1mhz ? clamping voltage: v cl =12v (typical) at i tlp =16a with r dyn =0.3 ? (typical) ? very low reverse current. i r <1na (typical) ? minimized clamping overshoot due to extremely low parasitic inductance ? small form factor smd size 0201 and low profile (0.58 mm x 0.28 mm x 0.15 mm) ? bidirectional and symmetric i/v characte ristics for optimized design and assembly ? pb-free (rohs compliant) and halogen free package table 1-1 part information type package configuration marking code ESD231-B1-W0201 wll-2-1 1 line, bi-directional m 1) 1) the device does not have any markin g or date code on the device backside. the marking code is on pad side. a) pin configuration configutation _schematic_diagram.vsd b) schematic diagram
ESD231-B1-W0201 maximum ratings finaldata sheet 4 revision 1.1, 2015-10-02 2 maximum ratings attention: stresses above the max. values listed here may cause permanent damage to the device. exposure to absolute maximum rating conditions for extended periods may affect device reliability. maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible dama ge to the component. table 2-1 maximum rating at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit reverse working voltage v rwm 5.5 v esd air discharge 2) esd contact discharge 2) 2) v esd according to iec61000-4-2 v esd 30 30 kv peak pulse power 3) p pk 132 w peak pulse current 3) 3) stress pulse: 8/20 s current waveform according to iec61000-4-5 i pp 12 a operating temperature t op -55 to 125 c storage temperature t stg -65 to 150 c table 2-2 thermal resistance parameter symbol values unit min. typ. max. junction - soldering point 1) 1) for calculation of r thja please refer to application note [3] 077 thermal resistance calculation. r thjs -30 k/w
ESD231-B1-W0201 electrical characteristics at t a = 25 c, unless otherwise specified finaldata sheet 5 revision 1.1, 2015-10-02 3 electrical characteristics at t a = 25 c, unless otherwise specified figure 3-1 definitions of electrical characteristics table 3-1 dc characteristics at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit note / test condition min. typ. max. trigger voltage v t1 6.1 9.5 ? v holding voltage v h 6.1 7.8 12.5 v i r =10ma reverse current i r ? ? 20 na v r =5.5v table 3-2 rf characteristics at t a = 25 c, unless otherwise specified parameter symbol values unit note / test condition min. typ. max. line capacitance c l 33.54.1pf v r =0v, f =1mhz ?3.2? v r =0v, f =1ghz        
 
  

  


    


           
  
       
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ESD231-B1-W0201 electrical characteristics at t a = 25 c, unless otherwise specified finaldata sheet 6 revision 1.1, 2015-10-02 table 3-3 esd and surge characteristics at t a = 25 c, unless otherwise specified 1) 1) device is electrically symmetrical parameter symbol values unit note / test condition min. typ. max. clamping voltage 2) 2) please refer to application note an210 [1] .tlp parameter: z 0 = 50 , t p = 100ns, t r = 0.6 ns. v cl ?12?v i tlp =16a, t p =100ns ?16? i tlp =30a, t p =100ns clamping voltage 3) 3) stress pulse: 8/20 s current waveform according to iec61000-4-5 ?8? i pp =2a, t p =8/20s ?10? i pp =9a, t p =8/20s dynamic resistance 2) r dyn ?0.3? t p =100ns
ESD231-B1-W0201 typical characteristics diagrams finaldata sheet 7 revision 1.1, 2015-10-02 4 typical characteristics diagrams typical characteristics diagrams at t a = 25c, unless otherwise specified figure 4-1 reverse leakage current: i r = f ( v r ) figure 4-2 line capacitance: c l = f ( v r ) 10 -13 10 -12 10 -11 10 -10 10 -9 10 -8 10 -7 10 -6 -5 -4 -3 -2 -1 0 1 2 3 4 5 i r [a] v r [v] 2.6 2.8 3 3.2 3.4 3.6 3.8 4 -5 -4 -3 -2 -1 0 1 2 3 4 5 c l [pf] v r [v] 1 mhz 1 ghz
ESD231-B1-W0201 typical characteristics diagrams finaldata sheet 8 revision 1.1, 2015-10-02 figure 4-3 clamping voltage (esd): v cl = f ( t ), 8 kv positive pulse figure 4-4 clamping voltage (esd): v cl = f ( t ), 8 kv negative pulse -15 0 15 30 45 -50 0 50 100 150 200 250 300 350 400 450 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = 31 v v cl-30ns-peak = 10 v -45 -30 -15 0 15 -50 0 50 100 150 200 250 300 350 400 450 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = -31 v v cl-30ns-peak = -9 v
ESD231-B1-W0201 typical characteristics diagrams finaldata sheet 9 revision 1.1, 2015-10-02 figure 4-5 clamping voltage (esd): v cl = f ( t ), 15 kv positive pulse figure 4-6 clamping voltage (esd): v cl = f ( t ), 15 kv negative pulse -15 0 15 30 45 60 -50 0 50 100 150 200 250 300 350 400 450 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = 47 v v cl-30ns-peak = 13 v -60 -45 -30 -15 0 15 -50 0 50 100 150 200 250 300 350 400 450 v cl [v] t p [ns] scope: 6 ghz, 20 gs/s v cl-max-peak = -47 v v cl-30ns-peak = -12 v
ESD231-B1-W0201 typical characteristics diagrams finaldata sheet 10 revision 1.1, 2015-10-02 figure 4-7 clamping voltage (tlp): i tlp = f ( v tlp ) [1] -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 -35 -30 -25 -20 -15 -10 -5 0 5 10 15 20 25 30 35 i tlp [a] equivalent v iec [kv] v tlp [v] ESD231-B1-W0201 r dyn r dyn = 0.3 r dyn = 0.3
ESD231-B1-W0201 typical characteristics diagrams finaldata sheet 11 revision 1.1, 2015-10-02 figure 4-8 clamping voltage (surge): i pp = f ( v cl ) [1] -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 i pp [a] v cl [v]
ESD231-B1-W0201 typical characteristics diagrams finaldata sheet 12 revision 1.1, 2015-10-02 figure 4-9 insertion loss vs. frequency in a 50 system 0 1 2 3 4 5 6 7 8 9 10 10 -2 0.1 1 10 insertion loss ( | s 21 | ) [db] frequency [ghz] ESD231-B1-W0201
ESD231-B1-W0201 package information finaldata sheet 13 revision 1.1, 2015-10-02 5 package information 5.1 wll-2-1 figure 5-1 wll-2-1 package outline (dimension in mm) figure 5-2 wll-2-1 footprint (dimension in mm) recommendation for printed circuit board assembly [2] figure 5-3 wll-2-1 packing (dimension in mm) figure 5-4 wll-2-1 marking example table 1-1 ?part information? on page 3 sg-wll-2-1-po v01 0.03 0.28 0.01 0.15 1 2 0.02 0.2 0.58 0.03 0.02 0.26 bottom view top view 0.36 (0.16) 0.27 0.19 0.19 0.19 copper solder mask stencil apertures 0.57 0.24 0.62 0.32 0.24 0.14 sg-wll-2-1-fp v01 2 0.23 sg-wll-2-1-tp v02 0.35 0.21 0.68 8 sg-wll-2-1-mk v03 1 1 type code 1 1 type code marking on pad-side
ESD231-B1-W0201 references finaldata sheet 8 revision 1.1, 2015-10-02 references [1] infineon ag - application note an210: effective esd protection design at system level using vf-tlp characterization methodology [2] infineon ag - recommendation for printed ci rcuit board assembly of infineon wll packages [3] infineon ag - application note an077: thermal resistance calculation http://www.infineon.com/dgdl/?fileid=db3a304344f7b4f9014503db540027c0 ??
ESD231-B1-W0201 finaldata sheet 9 revision 1.1, 2015-10-02 trademarks of infineon technologies ag aurix?, bluemoon?, c166?, ca npak?, cipos?, cipurse?, comn eon?, econopack?, coolmos?, coolset?, corecontrol?, crossave?, dave?, easypim?, econobri dge?, econodual?, econopim?, eicedriver?, eupec?, fcos?, hitfe t?, hybridpack?, i2rf?, isoface?, isopack?, mipaq?, modstack?, my-d?, novalithic?, omnitune?, optimos?, origa?, primarion?, primepack?, primestack?, pr o-sil?, profet?, rasic?, re versave?, satric?, sieget?, sindrion?, sipmos?, smarti?, smartlew is?, solid flash?, tempfet?, thinq!?, trenchstop?, tricore?, x-go ld?, x-pmu?, xmm?, xposys?. other trademarks advance design system? (ads) of agilent te chnologies, amba?, arm?, multi-ice?, keil?, primecell?, realview?, thumb?, vision? of arm limited, uk. autosar? is licensed by autosar development partnership. bluetooth? of bluetooth sig inc. cat-iq? of dect forum. colossus?, firstgps? of trimble navigation ltd. emv? of emvc o, llc (visa holdings in c.). epcos? of epcos ag. flexgo? of microsoft corp oration. flexray? is licensed by flexray consortium. hyperterminal? of hilgraeve incorporated. iec? of commission electrot echnique internationale. irda? of infrared data association corporation. iso? of international organization for standardization. matlab? of mathworks, inc. maxim? of maxim integrated products, inc. microtec?, nucleus? of mentor graphics corporation. mifare? of nx p. mipi? of mipi alliance, inc. mips? of mips technologies, inc., usa. murata? of murata manufacturing co., microwave offi ce? (mwo) of applied wave research inc., omnivision? of omnivision technologies, inc. open wave? openwave systems inc. red hat? red hat, inc. rfmd? rf micro devices, inc. sirius? of sirius sate llite radio inc. solaris? of sun microsystems, inc. spansion? of spansion llc ltd. symbian? of sy mbian software limited. taiyo yuden? of taiyo yuden co. teaklite? of ceva, inc. t ektronix? of tektroni x inc. toko? of toko kabushiki kaisha ta. unix? of x/open company limited. verilog?, palladium? of cadence design systems, inc. vlynq? of texas instruments inco rporated. vxworks?, wind river? of wind river systems, inc. zetex? of diodes zetex limited. last trademarks update 2010-10-26 revision history: rev. 1.0 2015-07-31 page or item subjects (major changes since previous revision) revision 1.1, 2015-10-02 all sales code change from esd231-b1-csp0201 to ESD231-B1-W0201
published by infineon technologies ag www.infineon.com


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